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1 ? fn6001.2 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 321-724-7143 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2001, 2004. all rights reserved all other trademarks mentioned are the property of their respective owners. ISL83385E +/-15kv esd protecte d, +3v to +5.5v, 1 microamp, 250kbps, rs-232 transmitters/receivers the intersil ISL83385E contains 3.0v to 5.5v powered rs-232 transmitters/receivers which meet ela/tia-232 and v.28/v.24 specifications, even at v cc = 3.0v. targeted applications are pdas, palm tops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. efficient on-chip charge pumps, coupled with a manual powerdown function reduces the standby supply current to a 1 a trickle. small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. data rates greater than 250kbps are guaranteed at worst case load conditions. this device is fully compatible with 3.3v only systems, mixed 3.3v and 5.0v systems, and 5.0v only systems. the single pin powerdown function (shdn = 0) disables all the transmitters, while shutting down the charge pump to minimize supply current drain. table 1 summarizes the featur es of the ISL83385E, while application note an9863 summarizes the features of each device comprising the 3v rs-232 family. features ? esd protection for rs-232 i/o pins to 15kv (iec61000) ? low power, pin compatible upgrade for max3385e ? single shdn pin disables transmitters ? rs-232 compatible outputs at 2.7v ? receivers active in powerdown ? meets eia/tia-232 and v.28/v .24 specifications at 3v ? latch-up free ? on-chip voltage converters require only four external 0.1 f capacitors ? receiver hysteresis for improved noise immunity ? very low supply current . . . . . . . . . . . . . . . . . . . . 0.3ma ? guaranteed minimum data rate . . . . . . . . . . . . . 250kbps ? guaranteed minimum slew rate . . . . . . . . . . . . . . . 6v/ s ? wide power supply range . . . . . . . single +3v to +5.5v ? low supply current in powerdow n state. . . . . . . . . .<1 a applications ? any system requiring rs-232 communication ports - battery powered, hand-held, and portable equipment - laptop computers, notebooks, palmtops - modems, printers and other peripherals - digital cameras - cellular/mobile phones ordering information part number temp. range (c) package pkg. dwg. # ISL83385Eca 0 to 70 20 ld ssop m20.209 ISL83385Eca-t 0 to 70 20 ld ssop tape and reel m20.209 ISL83385Eia -40 to 85 20 ld ssop m20.209 ISL83385Eia-t -40 to 85 20 ld ssop tape and reel m20.209 ISL83385Eib -40 to 85 18 ld soic m18.3 ISL83385Eib-t -40 to 85 18 ld soic tape and reel m18.3 table 1. summary of features part number no. of tx. no. of rx. no. of monitor rx. (r outb ) data rate (kbps) rx. enable function? ready output? manual power- down? automatic powerdown function? ISL83385E 2 2 0 250 no no yes no data sheet july 2004
2 pinouts ISL83385E (soic) top view ISL83385E (ssop) top view nc c1+ v+ c1- c2+ c2- v- t2 out r2 in shdn gnd t1 out r1 in r1 out t2 in v cc t1 in r2 out 18 17 16 15 14 13 12 11 10 1 2 3 4 5 6 7 8 9 nc c1+ v+ c1- c2+ c2- v- t2 out r2 in shdn gnd t1 out r1 in r1 out t2 in nc v cc t1 in r2 out 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 nc pin descriptions pin function v cc system power supply input (3.0v to 5.5v). v+ internally generated positive transmitter supply (+5.5v). v- internally generated negative transmitter supply (-5.5v). gnd ground connection. c1+ external capacitor (voltage doubler) is connected to this lead. c1- external capacitor (voltage doubler) is connected to this lead. c2+ external capacitor (voltage inverter) is connected to this lead. c2- external capacitor (voltage inverter) is connected to this lead. t in ttl/cmos compatible transmitter inputs. t out 15kv esd protected , rs-232 level (nominally 5.5v) transmitter outputs. r in 15kv esd protected , rs-232 compatible receiver inputs. r out ttl/cmos level receiver outputs. shdn active low input to shut down transmitters and on- board power supply, to place device in low power mode. ISL83385E
3 typical operating circuit ISL83385E (note 2) 17 v cc t1 out t2 out t1 in t2 in t 1 t 2 0.1 f + 0.1 f + 0.1 f 12 11 15 8 2 4 3 7 v+ v- c1+ c1- c2+ c2- + 0.1 f 5 6 r1 out r1 in 14 5k ? r2 out r2 in 9 10 5k ? 13 c 1 c 2 + c 3 c 4 shdn gnd 18 +3.3v to +5v + 0.1 f 16 v cc ttl/cmos logic levels rs-232 levels r 1 r 2 + c 3 (optional connect ion, note 1) notes: 1. the negative terminal of c 3 can be connected to either v cc or gnd. 2. pin numbers refer to soic package. ISL83385E
4 absolute maximum rati ngs thermal information v cc to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 6v v+ to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v v- to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3v to -7v v+ to v- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14v input voltages t in , shdn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 6v r in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25v output voltages t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2v r out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to v cc +0.3v short circuit duration t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table thermal resistance (typical, note 3) ja (c/w) 18 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . 75 20 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 125 maximum junction temperature (plastic package) . . . . . . . 150c maximum storage temperature range . . . . . . . . . . . -65c to 150c maximum lead temperature (soldering 10s) . . . . . . . . . . . . 300c (lead tips only) operating conditions temperature range ISL83385Ecx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0c to 70c ISL83385Eix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40c to 85c caution: stresses above those listed in ?absolute maximum ratings? may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. note: 3. ja is measured with the component mounted on a low effective therma l conductivity test board in free air. see tech brief tb379 fo r details. electrical specifications test conditions: v cc = 3v to 5.5v, c 1 - c 4 = 0.1 f; unless otherwise specified. typicals are at t a = 25c parameter test conditions temp (c) min typ max units dc characteristics supply current, enabled all outputs unloaded, shdn =v cc , v cc = 3.15v 25 - 0.3 1 ma supply current, powerdown shdn = gnd 25 - 1 10 a logic and transmitter inputs input logic threshold low t in , shdn full - - 0.8 v input logic threshold high t in , shdn v cc = 3.3v full 2.0 - - v v cc = 5.0v full 2.4 - - v transmitter input hysteresis 25 - 0.5 - v input leakage current t in , shdn full - 0.01 1.0 a receiver outputs output voltage low i out = 1.6ma full - - 0.4 v output voltage high i out = -1.0ma full v cc -0.6 v cc -0.1 - v receiver inputs input voltage range full -25 - 25 v input threshold low v cc = 3.3v 25 0.6 1.2 - v v cc = 5.0v 25 0.8 1.5 - v input threshold high v cc = 3.3v 25 - 1.5 2.4 v v cc = 5.0v 25 - 1.8 2.4 v input hysteresis 25 - 0.5 - v input resistance 25 3 5 7 k ? transmitter outputs output voltage swing all transmitter outputs loaded with 3k ? to ground full 5.0 5.4 - v output resistance v cc =v+=v-=0v, transmitter output= 2v full 300 10m - ? output short-circuit current full - 35 60 ma output leakage current v out = 12v, v cc = 0v or 3v to 5.5v, shdn =gnd full - - 25 a ISL83385E
5 detailed description the ISL83385E operates from a single +3v to +5.5v supply, guarantees a 250kbps minimum data rate, requires only four small external 0.1 f capacitors, features low power consumption, and meets all ela rs-232c and v.28 specifications. the circuit is di vided into three sections: the charge pump, the transmitters, and the receivers. charge-pump intersil?s new ISL83385E utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5v transmitter supplies from a v cc supply as low as 3.0v. this allows these devices to maintain rs-232 compliant output levels over the 10% tolerance range of 3.3v powered systems. the effi cient on-chip power supplies require only four small, external 0.1 f capacitors for the voltage doubler and inverter functions over the full v cc range; other capacitor combinations can be used as shown in table 3. the charge pumps operate discontinuously (i.e., they turn off as soon as the v+ and v- supplies are pumped up to the nominal values), resulting in significant power savings. transmitters the transmitters are proprietary, low dropout, inverting drivers that translate ttl/cm os inputs to eia/tia-232 output levels. coupled with the on-chip 5.5v supplies, these transmitters deliver tr ue rs-232 levels over a wide range of single supply system voltages. all transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see table 2). these outputs may be driven to 12v when disabled. all devices guarantee a 250kbps data rate for full load conditions (3k ? and 1000pf), v cc 3.0v, with one transmitter operating at full speed. under more typical conditions of v cc 3.3v, r l =3k ? , and c l = 250pf, one transmitter easily operates at 900kbps. transmitter inputs float if left unconnected (there are no pull- up resistors), and may cause i cc increases. connect unused inputs to gnd for the best performance. receivers the ISL83385E contains standard inverting receivers that convert rs-232 signals to cm os output levels and accept inputs up to 30v while presenting the required 3k ? to 7k ? input impedance (see figure 1) even if the power is off (v cc = 0v). the receivers? schmitt trigger input stage uses timing characteristics maximum data rate r l =3k ?, c l = 1000pf, one transmitter switching full 250 500 - kbps receiver propagation delay receiver input to receiver output, c l = 150pf t phl 25 - 0.15 - s t plh 25 - 0.15 - s transmitter output enable time from shdn rising edge to t out = 3.7v 25 - 100 - s transmitter skew t phl - t plh (note 4) 25 - 100 - ns receiver skew t phl - t plh 25 - 50 - ns transition region slew rate r l =3k ? to 7k ?, measured from 3v to -3v or -3v to 3v, v cc = 3.3v c l = 150pf to 1000pf 25 6 - 30 v/ s c l = 150pf to 2500pf 25 4 - 30 v/ s esd performance rs-232 pins (t out , r in ) human body model 25 - 15 - kv iec61000-4-2 air gap discharge 25 - 15 - kv iec61000-4-2 contact discharge 25 - 8-kv all other pins human body model 25 - 3-kv note: 4. transmitter skew is measured at the transmitter zero crossing points. electrical specifications test conditions: v cc = 3v to 5.5v, c 1 - c 4 = 0.1 f; unless otherwise specified. typicals are at t a = 25c (continued) parameter test conditions temp (c) min typ max units table 2. powerdown truth table shdn input transmitter outputs receiver outputs mode of operation h active active normal operation l high-z active manual powerdown ISL83385E
6 hysteresis to increase noise im munity and decrease errors due to slow input signal transitions. low power operation this 3v device requires a nominal supply current of 0.3ma, even at v cc = 5.5v, during normal operation (not in powerdown mode). this is cons iderably less than the 11ma current required by comparable 5v rs-232 devices, allowing users to reduce system power simply by replacing the old style device with the ISL83385E in new designs. powerdown functionality the already low current requirement drops significantly when the device enters powerdown mode. in powerdown, supply current drops to 1 a, because the on-chip charge pump turns off (v+ collapses to v cc , v- collapses to gnd), and the transmitter outputs three-state. this micro-power mode makes these devices ideal for battery powered and portable applications. software controlled (manual) powerdown the ISL83385E may be forced into its low power, standby state via a simple shutdown (shdn ) pin (see figure 2). driving this pin high enables normal operation, while driving it low forces the ic into it?s powerdown state. the time required to exit powerdown, and resume transmission is less than 100 s. connect shdn to v cc if the powerdown function isn?t needed. capacitor selection these charge pumps only require 0.1 f capacitors for the full operational voltage range. table 3 lists other acceptable capacitor values for various supply voltage ranges. do not use values smaller than those listed in table 3. increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. when using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. if in doubt, use ca pacitors with a larger nominal value. the capacitor?s equivalent series resistance (esr) usually rises at low temperat ures and it influences the amount of ripple on v+ and v-. power supply decoupling in most circumstances a 0.1 f bypass capacitor is adequate. in applications that are particularly sensitive to power supply noise, decouple v cc to ground with a capacitor of the same value as the charge-pump capacitor c 1 . connect the bypass capacitor as close as possible to the ic. operation down to 2.7v ISL83385E transmitter outputs meet rs-562 levels (3.7v), at the full data rate, with v cc as low as 2.7v. rs-562 levels typically ensure inter operability with rs-232 devices. transmitter outputs when exiting powerdown figure 3 shows the response of two transmitter outputs when exiting powerdown mode. as they activate, the two transmitter outputs properly go to opposite rs-232 levels, with no glitching, ringing, nor undesirable transients. each transmitter is loaded with 3k ? in parallel with 2500pf. note that the transmitters enable only when the magnitude of the supplies exceed approximately 3v. r xout gnd v rout v cc 5k ? r xin -25v v rin +25v gnd v cc figure 1. inverting receiver connections figure 2. connections for manual powerdown pwr shdn cpu i/o ISL83385E mgt logic uart table 3. required capacitor values v cc (v) c 1 ( f) c 2 , c 3 , c 4 ( f) 3.0 to 3.6 0.1 0.1 4.5 to 5.5 0.047 0.33 3.0 to 5.5 0.1 0.47 ISL83385E
7 high data rates the ISL83385E maintains the rs-232 5v minimum transmitter output voltages even at high data rates. figure 4 details a transmitter loopback test circuit, and figure 5 illustrates the loopback test result at 120kbps. for this test, all transmitters were simultaneously driving rs-232 loads in parallel with 1000pf, at 120kbps. figure 6 shows the loopback results for a single transmitter driving 1000pf and an rs-232 load at 250kbps. the static transmitter was also loaded with an rs-232 receiver. interconnection with 3v and 5v logic the ISL83385E directly interf aces with 5v cmos and ttl logic families. nevertheless, wi th the device at 3.3v, and the logic supply at 5v, ac, hc, and cd4000 outputs can drive ISL83385E inputs, but ISL83385E outputs do not reach the minimum v ih for these logic families. see table 4 for more information. figure 4. transmitter loopback test circuit time (20 s/div) t1 t2 2v/div 5v/div v cc = +3.3v shdn figure 3. transmitter outputs when exiting powerdown c1 - c4 = 0.1 f ISL83385E v cc c 1 c 2 c 4 c 3 + + + + 1000pf v+ v- 5k t in r out c1+ c1- c2+ c2- r in t out + v cc 0.1 f v cc shdn figure 5. loopback test at 120kbps figure 6. loopback test at 250kbps t1 in t1 out r1 out 5 s/div. v cc = +3.3v 5v/div. c1 - c4 = 0.1 f t1 in t1 out r1 out 2 s/div. 5v/div. v cc = +3.3v c1 - c4 = 0.1 f ISL83385E
8 15kv esd protection all pins on the 3v interface devices include esd protection structures, but the ISL83385E incorporates advanced structures which allow the rs-232 pins (transmitter outputs and receiver inputs) to survive esd events up to 15kv. the rs-232 pins are particularly vulnerable to esd damage because they typically connect to an exposed port on the exterior of the finished pro duct. simply touching the port pins, or connecting a cable, can cause an esd event that might destroy unprotected ics. these new esd structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and don?t interfere with rs-232 signals as large as 25v. human body mode l (hbm) testing as the name implies, this test method emulates the esd event delivered to an ic during human handling. the tester delivers the charge through a 1.5k ? current limiting resistor, making the test less severe th an the iec61000 test which utilizes a 330 ? limiting resistor. the hbm method determines an ics ability to withstand the esd transients typically present during handling and manufacturing. due to the random nature of these events, each pin is tested with respect to all other pins. the rs-232 pins on ?e? family devices can withstand hbm esd events to 15kv. iec61000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are t hose that are ex posed to the outside world (the rs-232 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pin-to -pin combination. the lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the hbm test. the extra esd protection built into this device?s rs-232 pins allows the design of equipment meeting level 4 criteria with out the need for additional board level protection on the rs-232 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. the ?e? device rs-232 pins withstand 15kv air-gap discharges. contact discharge test method during the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 8kv. all ?e? family devices survive 8kv contact discharges on the rs-232 pins. table 4. logic family compatibility with various supply voltages system power-supply voltage (v) v cc supply voltage (v) compatibility 3.3 3.3 compatible with all cmos families. 5 5 compatible with all ttl and cmos logic families. 5 3.3 compatible with act and hct cmos, and with ttl. ISL83385E outputs are incompatible with ac, hc, and cd4000 cmos inputs. typical performance curves v cc = 3.3v, t a = 25c figure 7. transmitter output voltage vs load capacitance figure 8. slew rate vs load capacitance -6.0 -4.0 -2.0 0 2.0 4.0 6.0 1000 2000 3000 4000 5000 0 load capacitance (pf) transmitter output voltage (v) 1 transmitter at 250kbps v out + v out - 1 transmitter at 30kbps load capacitance (pf) slew rate (v/ s) 0 1000 2000 3000 4000 5000 5 10 15 20 25 +slew -slew ISL83385E
9 die characteristics substrate potential (powered up) gnd transistor count 338 process si gate cmos figure 9. supply current vs load capacitance when transmitting data figure 10. supply current vs supply voltage typical performance curves v cc = 3.3v, t a = 25c (continued) 0 5 10 15 20 25 30 45 35 40 0 1000 2000 3000 4000 5000 load capacitance (pf) supply current (ma) 20kbps 250kbps 120kbps supply current (ma) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 0.5 1.0 1.5 2.0 supply voltage (v) 2.5 3.0 3.5 no load all outputs static ISL83385E
10 ISL83385E small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include interl ead flash or protrusions. interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. controlling dimension: millimeter . converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m18.3 (jedec ms-013-ab issue c) 18 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.0200 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.4469 0.4625 11.35 11.75 3 e 0.2914 0.2992 7.40 7.60 4 e 0.050 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n18 187 0 o 8 o 0 o 8 o - rev. 0 12/93
11 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com ISL83385E shrink small outline plastic packages (ssop) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. dimension ?e? does not include interlead flash or protrusions. in- terlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimension at maximum material condition. 10. controlling dimension: millimeter. converted inch dimen- sions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m b s e -a- b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 m20.209 (jedec mo-150-ae issue b) 20 lead shrink small outline plastic package symbol inches millimeters notes min max min max a 0.068 0.078 1.73 1.99 a1 0.002 0.008? 0.05 0.21 a2 0.066 0.070? 1.68 1.78 b 0.010? 0.015 0.25 0.38 9 c 0.004 0.008 0.09 0.20? d 0.278 0.289 7.07 7.33 3 e 0.205 0.212 5.20? 5.38 4 e 0.026 bsc 0.65 bsc h 0.301 0.311 7.65 7.90? l 0.025 0.037 0.63 0.95 6 n20 207 0 deg. 8 deg. 0 deg. 8 deg. rev. 3 11/02

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